IC and Chip Marking: Component-Level Traceability
Marking Requirements for ICs
Integrated circuits require permanent, legible marks on their top surface — typically an epoxy mold compound. Standard markings include:
- Manufacturer logo and part number
- Date code — Year and week of manufacture (e.g., “2523” = week 23 of 2025)
- Lot number — Production batch traceability
- Country of origin
- Pin 1 indicator — Orientation marker
Fiber Laser for IC Marking
The 1064nm fiber laser is the workhorse for IC package marking because:
- Epoxy mold compound absorbs 1064nm well
- Marking speeds exceed 5,000 mm/s for text and codes
- Deep engraving capability creates marks that survive handling and reflow
Typical fiber laser IC marking parameters:
- Power: 20W–30W
- Speed: 3,000–7,000 mm/s
- Depth: 10–50 μm
- Mark contrast: Light gray on dark epoxy
MOPA Fiber Lasers for IC Marking
MOPA (Master Oscillator Power Amplifier) fiber lasers offer adjustable pulse width, which is particularly valuable for IC marking:
- Short pulse width (2–10 ns) — Fine detail, minimal heat
- Long pulse width (50–200 ns) — Deeper engraving, higher contrast
- Color marking — Can produce dark marks on light-colored epoxy without deep engraving
A JPT MOPA 20W source gives IC marking engineers the flexibility to optimize for each package type without changing equipment.
When SMTech in Penang switched from a standard Q-switched laser to a MOPA fiber laser for their IC marking line, first-pass yield improved from 94.2% to 98.7%. “The adjustable pulse width let us tune the mark for each mold compound formulation,” explains their process engineer, Kwan. “No more rework from illegible date codes.”
